Title : 
Monolithic magnetic modules for aerospace power electronics applications
         
        
            Author : 
Varshney, Usha ; Eichelberger, Benn D. ; Neal, John A. ; Churchill, Russell J. ; Ngo, Khai D T ; Thibodeaux, Rene J.
         
        
            Author_Institution : 
American Res. Corp., Radford, VA, USA
         
        
        
        
            fDate : 
27 Jul-1 Aug 1997
         
        
        
            Abstract : 
In order to address the need for planar magnetic components with reduced weight and volume that can operate at high frequencies and high power densities in high temperature environments, this paper describes the feasibility of monolithic magnetic technology for the development of reliable high performance electrical power components and systems for next generation aerospace and more electric aircraft power management and distribution equipment applications. Monolithic magnetic technology involves the integration of all the magnetic and electronic components of a power converter into a single monolithic nonmagnetic module. The feasibility of the technology is demonstrated by integrating all magnetic components of a 100 W, 1 MHz, DC-DC, two-transistor forward power converter into a 63.5 mm×63.5 mm×5.0 mm single monolithic nonmagnetic module using a single plasma-spray fabrication process
         
        
            Keywords : 
DC-DC power convertors; avionics; ferrites; plasma arc sprayed coatings; power electronics; thick films; 1 MHz; 100 W; 5 mm; 63.5 mm; DC-DC two-transistor forward power converter; aerospace power electronics; ferrite thick films; high frequencies; high power densities; high temperature environments; monolithic magnetic modules; monolithic magnetic technology; more electric aircraft; planar magnetic components; plasma-spray fabrication process; power converter; power distribution equipment; power management equipment; thick films; Aerospace electronics; Aircraft; Energy management; Environmental management; Frequency; Magnetic devices; Plasma temperature; Power electronics; Power system reliability; Temperature distribution;
         
        
        
        
            Conference_Titel : 
Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
         
        
            Conference_Location : 
Honolulu, HI
         
        
            Print_ISBN : 
0-7803-4515-0
         
        
        
            DOI : 
10.1109/IECEC.1997.659216