Title :
An advanced packaging technology for high performance power devices
Author :
Ozmat, B. ; Temple, V.A.K. ; Azotea, J.K.
Author_Institution :
Harris Semicond., Latham, NY, USA
fDate :
27 Jul-1 Aug 1997
Abstract :
Packaging related performance and reliability aspects of the advanced power modules were discussed. A new approach for the packaging of high performance power devices for both commercial and military applications was introduced. The resistance of device package was modeled. The results of closed form solutions and finite element analysis (FEA) were presented. The metalization and patterning of the first level package was discussed. The thermal performance of a typical power module with various heat spreader materials and configurations was analyzed by using 3D FEA techniques
Keywords :
finite element analysis; packaging; power electronics; reliability; semiconductor device metallisation; 3D FEA techniques; advanced power modules; closed form solutions; commercial applications; device package resistance modeling; finite element analysis; heat spreader materials; high performance power devices; metalization; military applications; packaging technology; patterning; reliability; thermal performance; Anodes; Bonding; Circuits; Lead; Multichip modules; Semiconductor device packaging; Semiconductor device reliability; Thermal conductivity; Thyristors; Wires;
Conference_Titel :
Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
Conference_Location :
Honolulu, HI
Print_ISBN :
0-7803-4515-0
DOI :
10.1109/IECEC.1997.659273
