Designing to digital wireless specifications using Circuit Envelope simulation

Author

Yap, How-Siang

Author_Institution

EEsof Div., Hewlett-Packard Co., USA

Volume

1

fYear

1997

fDate

2-5 Dec 1997

Firstpage

173

Abstract

Circuit Envelope is a circuit simulation technology developed specifically to simulate modern wireless circuits with complex digitally modulated RF signals such as CDMA and TDMA. In this paper, Circuit Envelope technology is explained and is contrasted with Spice and harmonic balance simulators. The applications of Circuit Envelope are then demonstrated in the simulation of phase-locked loops (PLL); amplifier adjacent channel power ratio (ACPR) and noise power ratio (NPR); and IQ-modulator error vector magnitude (EVM)

Keywords

circuit CAD; circuit analysis computing; digital radio; modulation; telecommunication computing; ACPR; CDMA; Circuit Envelope simulation; IQ-modulator error vector magnitude; NPR; PLL; TDMA; amplifier adjacent channel power ratio; circuit simulation technology; complex digitally modulated RF signals; digital wireless specifications; noise power ratio; phase-locked loops; wireless circuits; Circuit noise; Circuit simulation; Digital modulation; Multiaccess communication; Phase locked loops; Phase noise; Power amplifiers; Radiofrequency amplifiers; Signal to noise ratio; Time division multiple access;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings, 1997. APMC '97, 1997 Asia-Pacific

Print_ISBN

962-442-117-X

Type

conf

DOI

10.1109/APMC.1997.659332

Filename

659332