DocumentCode :
3216393
Title :
Development of SmartStep: An insole-based physical activity monitor
Author :
Sazonov, Edward S. ; Hegde, Nayana ; Wenlong Tang
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Alabama, Tuscaloosa, AL, USA
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
7209
Lastpage :
7212
Abstract :
In our previous research we developed a SmartShoe-a shoe based physical activity monitor that can reliably differentiate between major postures and activities, accurately estimate energy expenditure of individuals, measure temporal gait parameters, and estimate body weights. In this paper we present the development of the next stage of the SmartShoe evolution-SmartStep, a physical activity monitor that is fully integrated into an insole, maximizing convenience and social acceptance of the monitor. Encapsulating the sensors, Bluetooth Low Energy wireless interface and the energy source within an assembly repeatedly loaded with high forces created during ambulation presented new design challenges. In this preliminary study we tested the ability of the SmartStep to measure the pressure differences between static weight-bearing and non-weight-bearing activities (such as no load vs. sitting vs. standing) as well as capture pressure variations during walking. We also measured long-term stability of the sensors and insole assembly under cyclic loading in a mechanical testing system.
Keywords :
Bluetooth; computerised monitoring; gait analysis; graphical user interfaces; mechanical testing; medical computing; patient monitoring; sensors; wearable computers; Bluetooth low energy wireless interface; SmartShoe evolution; energy source; insole-based physical activity monitor; mechanical testing system; sensors; static weight-bearing activities; walking; Accelerometers; Biomedical monitoring; Legged locomotion; Loading; Monitoring; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6611221
Filename :
6611221
Link To Document :
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