Abstract :
The following topics are dealt with: materials and processing; quality and reliability; electrical modeling; optoelectronics; advanced packaging; manufacturing technology; microsystems packaging; thermal-mechanical modeling; passive components; and emerging technologies
Keywords :
electronics packaging; integrated circuit manufacture; integrated circuit modelling; optoelectronic devices; reliability; semiconductor process modelling; soldering; solders; advanced packaging; electrical modeling; manufacturing technology; materials processing; microsystems packaging; optoelectronics; passive components; reliability; thermal-mechanical modeling;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
DOI :
10.1109/ESTC.2006.279957
