Generalization of log-location-scale regression model to thermal fatigue reliability in electronic packaging

Author

Jiang, Mingxiao ; Loman, James

Author_Institution

GE Global Res. Center, Niskayuna, NY, USA

fYear

2003

fDate

2003

Firstpage

513

Lastpage

517

Abstract

The reliability evaluation of important components in electronic packaging usually is done using finite element analysis (FEA), which is a deterministic approach. Many sophisticated statistical models have been developed for general life data analysis. However, little work has been done to integrate numerical results from FEA, highly censored statistical life data and the statistical regression models available in literature. The present paper proposes such an integrated approach.

Keywords

finite element analysis; packaging; reliability; statistical analysis; thermal analysis; thermal stress cracking; FEA; deterministic approach; electronic packaging; finite element analysis; highly censored statistical life data; life data analysis; log-location-scale regression model; reliability evaluation; statistical regression models; thermal fatigue reliability; Capacitive sensors; Electronic packaging thermal management; Electronics packaging; Fatigue; Finite element methods; Life estimation; Materials reliability; Optical materials; Optical scattering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability and Maintainability Symposium, 2003. Annual

ISSN

0149-144X

Print_ISBN

0-7803-7717-6

Type

conf

DOI

10.1109/RAMS.2003.1182041

Filename

1182041