Generalization of log-location-scale regression model to thermal fatigue reliability in electronic packaging

The reliability evaluation of important components in electronic packaging usually is done using finite element analysis (FEA), which is a deterministic approach. Many sophisticated statistical models have been developed for general life data analysis. However, little work has been done to integrate numerical results from FEA, highly censored statistical life data and the statistical regression models available in literature. The present paper proposes such an integrated approach.