DocumentCode :
3219294
Title :
Localized elecron cyclotron resonance plasma source for hyperthermal neutral beam
Author :
Yoo, S.J. ; Kim, D.C. ; Lee, B.J. ; Kim, S.B. ; Cho, M.
Author_Institution :
Nat. Fusion Res. Inst., Daejeon, South Korea
fYear :
2009
fDate :
1-5 June 2009
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. Hyperthermal neutral beams (HNB) have a great potential for semiconductor processes, especially, for etchings and thin film depositions for semiconductor and display fabrications as well as depositions for various thin film applications. Thermal and plasma-induced damages are serious problems for manufacturing deep submicron semiconductor devices and are also expected to be problems for future nanoscale devices. These problems can be overcome by damage-free and low-temperature processes with hyperthermal neutral beams. The HNB process is especially applicable to various thin film growings: oxidation and nitridation for gate insulators of DRAMs and flash memories, transparent conductive oxide films on organic light emitting diodes (OLEDs) or flexible displays, Si thin films for solar cells and thin film transistors (TFT), and crystal thin film growing for optoelectronic devices such as light emitting diodes (LEDs). The HNB can be produced by neutralization of ion beams extracted from an ion sources. However, the flux of the ion beams at a hyperthermal energy range is much lower than required in industrial applications due to the space charge effect. So, in order to obtain a high flux particle beam at a hyperthermal energy range, the ion beams should be neutralized before extracted from a plasma source. The plasma required for a high flux HNB sources should be operated at a lower pressure than 1 mTorr in order to reduce the HNB loss due to collisions with the background gas. The plasmas should also be so thin that the HNB cannot be lost by reionization during passing through the plasmas. We have developed a localized ECR plasma source with a racetrack magnetic field configuration in order to produce a high flux HNB. The operating pressure is 0.3 mTorr and the plasma thickness is less than 25 mm. The plasma is mainly characterized by the line ratio method of the optical emission spectroscopy (OES).
Keywords :
ion beams; low-temperature techniques; plasma materials processing; plasma radiofrequency heating; plasma sources; plasma-beam interactions; semiconductor device manufacture; thin films; HNB; Si thin films; crystal thin film growing; damage-free processes; display fabrications; etchings; flexible displays; gate insulators; high flux particle beam; hyperthermal neutral beam; ion beam neutralization; line ratio method; localized ECR plasma source; localized electron cyclotron resonance plasma source; low-temperature processes; nitridation; optical emission spectroscopy; optoelectronic devices; organic light emitting diodes; oxidation; pressure 0.3 mtorr; racetrack magnetic field configuration; semiconductor device manufacturing; semiconductor processes; solar cells; thin film depositions; thin film transistors; transparent conductive oxide films; Conductive films; Cyclotrons; Hyperthermia; Organic thin film transistors; Particle beams; Plasma applications; Plasma sources; Resonance; Semiconductor thin films; Thin film devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science - Abstracts, 2009. ICOPS 2009. IEEE International Conference on
Conference_Location :
San Diego, CA
ISSN :
0730-9244
Print_ISBN :
978-1-4244-2617-1
Type :
conf
DOI :
10.1109/PLASMA.2009.5227678
Filename :
5227678
Link To Document :
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