Early analysis of cost/performance trade-offs in MCM systems

Author

Garg, Vivek ; Schimmel, David E. ; Stogner, Durrell ; Ulmer, Craig ; Wills, D. Scott ; Yalamanchili, Sudhakar

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1996

fDate

9-11 Oct 1996

Firstpage

228

Lastpage

237

Abstract

This paper explores early analysis of the complex relationships between system architectures and the active and packaging materials from which they are implemented. The goals of this analysis are to enable the designer to specify cost effective technologies for a particular system and to uncover resources which may be exploited to increase performance of such a system, early in the design process. We describe a prototype tool called IMPACT which predicts cost, performance, power, and reliability, and demonstrate its use on several problems

Keywords

circuit analysis computing; integrated circuit reliability; multichip modules; IMPACT tools; MCM systems; cost predictions; cost/performance tradeoffs; performance prediction; power prediction; prototype tool; reliability prediction; Chip scale packaging; Costs; Design methodology; Inductance; Integrated circuit interconnections; Integrated circuit packaging; Parasitic capacitance; Power system reliability; Printed circuits; Surface resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Innovative Systems in Silicon, 1996. Proceedings., Eighth Annual IEEE International Conference on

Conference_Location

Austin, TX

ISSN

1063-2204

Print_ISBN

0-7803-3639-9

Type

conf

DOI

10.1109/ICISS.1996.552430

Filename

552430