Title :
Early analysis of cost/performance trade-offs in MCM systems
Author :
Garg, Vivek ; Schimmel, David E. ; Stogner, Durrell ; Ulmer, Craig ; Wills, D. Scott ; Yalamanchili, Sudhakar
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper explores early analysis of the complex relationships between system architectures and the active and packaging materials from which they are implemented. The goals of this analysis are to enable the designer to specify cost effective technologies for a particular system and to uncover resources which may be exploited to increase performance of such a system, early in the design process. We describe a prototype tool called IMPACT which predicts cost, performance, power, and reliability, and demonstrate its use on several problems
Keywords :
circuit analysis computing; integrated circuit reliability; multichip modules; IMPACT tools; MCM systems; cost predictions; cost/performance tradeoffs; performance prediction; power prediction; prototype tool; reliability prediction; Chip scale packaging; Costs; Design methodology; Inductance; Integrated circuit interconnections; Integrated circuit packaging; Parasitic capacitance; Power system reliability; Printed circuits; Surface resistance;
Conference_Titel :
Innovative Systems in Silicon, 1996. Proceedings., Eighth Annual IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3639-9
DOI :
10.1109/ICISS.1996.552430
