MEMS-microfabricated components for millimeter-wave and THz TWTs

Summary form only given. Microfabrication techniques used for MEMS offer promising advantages for fabrication of mm-wave and THz vacuum electronic devices (μVEDs). This paper describes results of an exploratory investigation of several microfabrication methods considered candidates for production of circuits or circuit components for mm-wave and THz TWTs. The processes investigated have included LIGA, hot embossing (polymer micromolding), and deep reactive ion etching (DRIE). The circuits and circuit components investigated have included folded waveguides (FWGs), gratings, resistive wall amplifiers, and novel attenuators for FWG TWTs. We present and discuss the results of the microfabrication experiments, the design analyses, and their implications for advanced mm-wave and THz μVEDs.