The Westinghouse high density microwave packaging program

Author

Costello, J.A. ; Kline, Mitchell ; Kuss, F. ; Marsh, W. ; Kam, R. ; Fasano, B. ; Berry, M. ; Koopman, N.

Author_Institution

Westinghouse Electr. Corp., Baltimore, MD, USA

fYear

1995

fDate

16-20 May 1995

Firstpage

177

Abstract

The Westinghouse High Density Microwave Packaging (HDMP) Program investigates advanced packaging and interconnects for next generation Active Electronically Scanned Arrays (AESA´s). Our teaming partners include TRW, IBM, and MCNC. The overall goal of the program is to develop appropriate designs, materials, and manufacturing processes that lead to the production of highly interconnected, very thin radar Transmit/Receive (T/R) modules with the following benefits (4:1 Cost Reduction, 10:1 Volume, Weight Reduction). Early on, interim demonstrations are planned to establish advanced packaging and interconnect processes of multiple T/R cell tiles. In the last two years of the program, these processes will be used to fabricate functional T/R cell hardware culminating with the delivery of 50 T/R cells. In this paper, the program objectives, schedule, and technologies are reviewed.<>

Keywords

electronic equipment manufacture; integrated circuit interconnections; microassembling; microwave circuits; modules; packaging; phased array radar; radar equipment; Westinghouse; active electronically scanned arrays; high density microwave packaging program; interconnects; manufacturing processes; radar T/R modules; transmit/receive modules; Assembly; Costs; Electronics packaging; Hardware; Performance evaluation; Phased arrays; Radar; Radio frequency; Testing; Tiles;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1995., IEEE MTT-S International

Conference_Location

Orlando, FL, USA

ISSN

0149-645X

Print_ISBN

0-7803-2581-8

Type

conf

DOI

10.1109/MWSYM.1995.406071

Filename

406071