Title :
Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
Author :
Andersson, Clas ; Liu, L. ; Liu, Jiangchuan
Author_Institution :
Dept. of Microtechnology & Nanoscience, Chalmers Univ. of Technol., Gothenburg
Abstract :
The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to the Sn-Ag-Cu alloys. The Sn-Co-Cu system eutectic composition was obtained by means of CALPHAD (calculation of phase diagram) methodology. The composition of the Sn-rich, eutectic Sn-Co-Cu system was found to be 0.4%Co and 0.7%Cu (wt%) with a melting point of 224degC The tensile behavior of the eutectic Sn-0.4Co-0.7Cu bulk samples was studied under three different conditions of strain rates (10-6, 10-4 and 10-3/s) and compared to both Sn-37Pb and Sn-4.0Ag-0.5Cu alloys. The evaluation of the tensile results showed that the effect of strain rate played an important roll on the tensile properties of these alloys, and it is clearly observed that the tensile strength increases as the strain rate increases. Furthermore, Sn-4.0Ag-0.5Cu alloy shows better ultimate tensile strength (UTS) followed by Sn-37P and Sn-0.4Co-0.7Cu system
Keywords :
cobalt alloys; copper alloys; eutectic alloys; lead alloys; mechanical properties; phase diagrams; silver alloys; solders; tensile strength; tin alloys; 224 C; CALPHAD; SnAgCu; SnCoCu; SnPb; calculation of phase diagram; eutectic bulk samples; eutectic lead free alloy; eutectic solder alloy; mechanical properties; strain rates; tensile behavior; ultimate tensile strength; Capacitive sensors; Environmentally friendly manufacturing techniques; Lead; Materials testing; Mechanical factors; Plastics; Silver; Tensile strain; Tensile stress; Thermodynamics;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.279993
