DocumentCode :
3220047
Title :
Silicon carbide power devices for high temperature, high power density switching applications
Author :
Burke, T. ; Xie, K. ; Flemish, J.R. ; Singh, H. ; Podlesak, T. ; Zhao, J.H.
Author_Institution :
US Army Res. Lab., Fort Monmouth, NJ, USA
fYear :
1996
fDate :
25-27 Jun 1996
Firstpage :
18
Lastpage :
21
Abstract :
Silicon carbide (SiC) has been attracting much attention because of its potential application to high performance power devices with the capability of operating at high temperature. Here, the authors briefly describe SiC´s advantages for high pulsed power devices, review the state-of the-art in prototype SiC power device performance and present simulation results and thermal calculations which predict the capability of SiC thyristors in high-power pulse applications
Keywords :
pulsed power switches; silicon compounds; thermal analysis; SiC; SiC pulsed power switches; application; capability prediction; high temperature operation; power device performance; simulation results; state-of the-art; thermal calculations; Application software; Breakdown voltage; Current density; MOSFETs; Prototypes; Silicon carbide; Temperature; Thermal conductivity; Thermal resistance; Thyristors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Modulator Symposium, 1996., Twenty-Second International
Conference_Location :
Boca Raton, FL
Print_ISBN :
0-7803-3076-5
Type :
conf
DOI :
10.1109/MODSYM.1996.564439
Filename :
564439
Link To Document :
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