Title :
Lead free solder process development and reliability for handset application
Author :
Zhu, Sherry ; Nguyen, Cam
Author_Institution :
Kyocera Wireless Corp., San Diego, CA, USA
Abstract :
Recent worldwide lead free activity has been driving international and US consumer electronic companies to be lead free. This paper identifies the challenges, critical issues and solutions for implementing lead free soldering process for handset application, and describes the studies conducted on Sn/Ag/Cu and Sn/Ag/Bi solder, process development and reliability results for handset manufacturing. The paper described wettability, printability and reflow results, electrical characterization, drop shock, thermal cycling test, humidity test and mechanical reliability results. Process DOE results are also discussed in the paper. Traditional eutectic solder is used as the baseline for comparison.
Keywords :
design of experiments; reflow soldering; reliability; telephone sets; Sn-Ag-Bi; Sn-Ag-Cu; design of experiments; drop shock; electrical characterization; handset application; handset manufacturing; humidity test; lead free solder process development; lead free solder process reliability; lead free soldering process; mechanical reliability; printability; reflow results; thermal cycling test; wettability; Bismuth; Consumer electronics; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Pulp manufacturing; Soldering; Telephone sets; Testing; Tin;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2005.1432056
