• DocumentCode
    3220206
  • Title

    Space charge formation in filled LDPE films

  • Author

    Yin, Weijun ; Tariaka, J. ; Damon, Dwight H.

  • Author_Institution
    Connecticut Univ., Storrs, CT, USA
  • fYear
    1992
  • fDate
    22-25 Jun 1992
  • Firstpage
    32
  • Lastpage
    36
  • Abstract
    The effect of fillers on space charge formation or storage was studied. Thermally stimulated current (TSC) was measured to investigate the carrier traps in filled LDPE (low-density polyethylene) films. The characteristic relaxation time and activation energy of trapped carriers were calculated by computer simulation based on a single relaxation time model. Differential scanning calorimetry (DSC), dynamic mechanical thermal analysis (DTMA), and time-domain dielectric loss spectrometry (TDS) were also employed to analyze the effect of fillers on molecular relaxation behavior. The characteristic relaxation times for 10% 3A/LDPE and 5% 5A/LDPE are 4×10-11 s and 5×10-11 s, respectively. The corresponding activation energies are 0.5016 eV and 0.4878 eV
  • Keywords
    carrier relaxation time; dielectric losses; electron traps; filled polymers; organic insulating materials; polymer films; polymer structure; space charge; thermal analysis; thermally stimulated currents; DSC; TSC; activation energy; carrier traps; characteristic relaxation time; computer simulation; dynamic mechanical thermal analysis; effect of fillers; filled LDPE films; molecular relaxation behavior; single relaxation time model; space charge formation; time-domain dielectric loss spectrometry; Calorimetry; Computer simulation; Current measurement; Dielectric losses; Dielectric measurements; Electrochemical impedance spectroscopy; Plastic films; Polyethylene; Space charge; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Conduction and Breakdown in Solid Dielectrics, 1992., Proceedings of the 4th International Conference on
  • Conference_Location
    Sestri Levante
  • Print_ISBN
    0-7803-0129-3
  • Type

    conf

  • DOI
    10.1109/ICSD.1992.224955
  • Filename
    224955