DocumentCode :
3220243
Title :
Environmentally benign materials for electronics: a review of current developments and emerging technologies
Author :
Lincoln, John D. ; Ogunseitan, Oladele A. ; Saphores, Jean-Daniel M. ; Schoenung, Julie M. ; Nixon, Hilary ; Shapiro, Andrew A.
Author_Institution :
Dept. of Chem. Eng. & Mater. Sci., California Univ., Irvine, CA, USA
fYear :
2005
fDate :
16-18 March 2005
Firstpage :
139
Lastpage :
143
Abstract :
Materials used in handheld consumer electronic devices (CEDs), such as cell phones or personal digital assistants, create environmental risks both during procurement and disposal. The increasing global demand for CEDs and recent legislative pressure motivate our review of alternative materials that could make CEDs more environmentally friendly. Hazardous materials considered include brominated flame retardants, lead-based solders, hexavalent chromium, and copper. We survey recent research in the development of environmentally benign replacement materials, provide a brief assessment of the potential environmental, industrial, and economic consequences of their substitution, and assess progress in their industrial application. Identifying appropriate environmentally benign replacement materials provides a starting point for developing environmentally friendly CED prototypes.
Keywords :
cellular radio; consumer electronics; design for environment; electronics packaging; environmental factors; hazardous materials; notebook computers; brominated flame retardants; cell phones; consumer electronic devices; copper; disposal; economic consequences; electronics; environmental consequences; environmentally benign replacement materials; hazardous materials; hexavalent chromium; industrial consequences; lead-based solders; personal digital assistants; procurement; Cellular phones; Chromium; Consumer electronics; Copper; Flame retardants; Hazardous materials; Industrial economics; Lead; Personal digital assistants; Procurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
ISSN :
1550-5723
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
Type :
conf
DOI :
10.1109/ISAPM.2005.1432064
Filename :
1432064
Link To Document :
بازگشت