Title :
Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials
Author :
Jiang, Hongjin ; Moon, Kyoung-Sik ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng. & Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Silver-copper alloy nanoparticles were synthesized via the polyol process in preparation for the conductive fillers in electrically conductive adhesives. UV absorption and TEM observations showed that the synthesized silver-copper nanoparticles had a randomly mixed alloy structure rather than a core-shell structure, although bulk silver and copper cannot form a solid solution at room temperature.
Keywords :
adhesives; conducting polymers; copper alloys; filled polymers; filler metals; integrated circuit interconnections; materials preparation; nanoparticles; powder technology; powders; silver alloys; Ag-Cu alloy nanoparticle synthesis; AgCu; TEM observation; UV absorption; conductive filler; electrically conductive adhesive; lead-free interconnect material; mixed alloy structure; polyol process; silver-copper alloy; Chemicals; Conducting materials; Conductivity; Copper; Environmentally friendly manufacturing techniques; Gold; Lead; Nanoparticles; Polymers; Silver;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2005.1432072
