Title :
Vorpal as a Tool for Three-Dimensional Simulations of Multipacting in Superconducting RF Cavities
Author :
Nieter, C. ; Stoltz, P.H. ; Cary, J.R. ; Werner, G.R.
Author_Institution :
Tech-X Corporation, Boulder, CO, nieter@txcorp.com
Abstract :
Considerable resources are required to run three dimensional simulations of multipacting in superconducting radio frequency cavities. Three dimensional simulations are needed to understand the possible roles of non-axisymmetric features such as the power couplers. Such simulations require the ability to run in parallel. We consider the versatile plasma simulation code VORPAL as a possible platform to study such effects. VORPAL has a general 3D domain decomposition and can run in any physical dimension. VORPAL uses the CMEE library to model the secondary emission of electrons from metal surfaces. We present a three dimensional simulation of a simple pillbox RF cavity to demonstrate the potential of VORPAL to be a major simulation tool for superconducting radio frequency (SRF) cavities.
Keywords :
Computational modeling; Couplers; Electron emission; Libraries; Linux; Multidimensional systems; Plasma simulation; Radio frequency; Supercomputers; Testing;
Conference_Titel :
Particle Accelerator Conference, 2005. PAC 2005. Proceedings of the
Print_ISBN :
0-7803-8859-3
DOI :
10.1109/PAC.2005.1591812