DocumentCode
3220556
Title
Studies on influence of seed electrons and physical dimensions of hollow cathode on Pseudospark discharge
Author
Vyas, G.L. ; Meena, B.L. ; Pal, Udit Narayan ; Kumar, Manoj ; Tyagi, M.S. ; Sharma, Arvind Kumar
Author_Institution
Microwave Tubes Div., Central Electron. Eng. Res. Inst. CEERI, Pilani, India
fYear
2010
fDate
14-16 Oct. 2010
Firstpage
148
Lastpage
149
Abstract
Pseudospark discharge is a specific type of gas discharge, which operates on the left-hand side of the hollow cathode analogy to the Paschen curve with axially symmetric parallel electrodes and central holes on the electrodes. Plasma simulation is carried out to study the initiation phase of pseudospark discharges. The pre-breakdown and breakdown phases of a pseudospark discharge are investigated using the two-dimensional kinetic plasma simulation code OOPIC Pro. Trends in the electron density at the anode are presented as function of the hollow cathode dimensions and mean seed injection velocities at the cavity back wall. The plasma generation process by ionizing collisions is examined, showing the effect on supplying electrons that determine the density of the beam. The experiment has also been performed for the analysis of the pseudospark discharge. The predischarge is a function of hollow cathode dimension, bore hole diameter and trigger source position and for two case of seed electron energy. Applied voltage was also held steady during operation.
Keywords
cathodes; discharges (electric); plasma density; plasma simulation; Paschen curve; axially symmetric parallel electrodes; bore hole diameter; breakdown phases; cavity back wall; electron density; gas discharge; hollow cathode; hollow cathode dimension; hollow cathode dimensions; ionizing collisions; pseudospark discharge; seed electron energy; seed injection velocities; trigger source position; two-dimensional kinetic plasma simulation code OOPIC Pro;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electron Sources Conference and Nanocarbon (IVESC), 2010 8th International
Conference_Location
Nanjing
Print_ISBN
978-1-4244-6645-0
Type
conf
DOI
10.1109/IVESC.2010.5644413
Filename
5644413
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