Title :
An investigation of machining performance for controlled surface quality requirements in porous tungsten [for dispenser cathodes]
Author :
Chen, S. ; Jawahir, I.S.
Author_Institution :
Dept. of Mech. Eng., Kentucky Univ., Lexington, KY, USA
Abstract :
The proposed work in this paper will concentrate on modeling and optimization of face-contour turning of porous tungsten for controlled surface quality requirements. A study of the combined effects of workpiece geometry, work material properties, tool geometry (i.e., cutting edge radius, nose radius, rake angle, inclination angle, etc.), tool material properties (carbide and diamond tool inserts), and machining conditions (cutting speed, depth of cut, and feed) on the porosity in face-contour turning of porous tungsten was undertaken. There are many analyzable characteristics of the cutting phenomenon that can be determined from the output of the system. The empirical data needed for developing accurate modeling equations can be acquired from this output criteria. The cutting edge radius of the tool insert can be measured before and after the machining process with a white light interferometer to determine the initial patterns of wear on the cutting edge. The chips being removed will be gathered and classified. The forces applied to the workpiece will be measured with a multi axis Fischer dynamometer to determine the resultant and component forces at the insert to material interface.
Keywords :
cathodes; cutting; machinability; optimised production technology; porosity; porous materials; surface finishing; tungsten; turning (machining); W; carbide tool inserts; controlled surface quality requirements; cutting edge radius; cutting speed; depth of cut; diamond tool inserts; dispenser cathodes; face-contour turning; inclination angle; insert-material interface; machining conditions; machining performance; modeling; nose radius; optimization; porous tungsten; rake angle; repeatability; tool geometry; work material properties; workpiece geometry; Cathodes; Equations; Feeds; Geometry; Machining; Material properties; Nose; Semiconductor device measurement; Tungsten; Turning;
Conference_Titel :
Vacuum Electronics Conference, 2004. IVEC 2004. Fifth IEEE International
Print_ISBN :
0-7803-8261-7
DOI :
10.1109/IVELEC.2004.1316360