Title :
Applying A Low-cost Linear Inspection System For High Precision Measurement Of IC Leadframes
Author_Institution :
French-Singapore Institute
Keywords :
Assembly; Bonding; Fingers; Image processing; Inspection; Machine vision; Manufacturing automation; Microscopy; Production; Prototypes;
Conference_Titel :
Industrial Electronics Society, 1988. IECON '88. Proceedings., 14 Annual Conference of
Conference_Location :
Singapore
DOI :
10.1109/IECON.1988.662379
