Title :
An engineering model for moisture degradation of polymer/metal interfacial fracture toughness
Author :
Ferguson, Timothy P. ; Qu, Jianmin
Author_Institution :
Georgia W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.
Keywords :
composite material interfaces; failure analysis; filled polymers; fracture mechanics; interface roughness; semiconductor process modelling; semiconductor-insulator boundaries; engineering model; interface hydrophobicity; interfacial fracture mechanics; moisture concentration; moisture degradation; polymer-metal interfacial fracture toughness; Adhesives; Copper; Electronic mail; Electrostatics; Mechanical engineering; Moisture; Polymers; Predictive models; Thermal degradation; Thermodynamics;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2005.1432093
