DocumentCode
3220985
Title
An engineering model for moisture degradation of polymer/metal interfacial fracture toughness
Author
Ferguson, Timothy P. ; Qu, Jianmin
Author_Institution
Georgia W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2005
fDate
16-18 March 2005
Firstpage
298
Lastpage
301
Abstract
Based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.
Keywords
composite material interfaces; failure analysis; filled polymers; fracture mechanics; interface roughness; semiconductor process modelling; semiconductor-insulator boundaries; engineering model; interface hydrophobicity; interfacial fracture mechanics; moisture concentration; moisture degradation; polymer-metal interfacial fracture toughness; Adhesives; Copper; Electronic mail; Electrostatics; Mechanical engineering; Moisture; Polymers; Predictive models; Thermal degradation; Thermodynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
ISSN
1550-5723
Print_ISBN
0-7803-9085-7
Electronic_ISBN
1550-5723
Type
conf
DOI
10.1109/ISAPM.2005.1432093
Filename
1432093
Link To Document