Title :
5-15 GHz range surface acoustic wave filters using electrode thickness difference type and new reflector bank type of unidirectional interdigital transducers
Author :
Yamanouchi, K. ; Qureshi, J.A. ; Odagawa, H.
Author_Institution :
Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
Abstract :
The frequency range of mobile communication systems is in the 2-GHz range and is extending to 3-4 GHz. In the next stage, SAW devices in the frequency of about 5-10 GHz will be needed. To meet the above challenges nanometer fabrication technology of below 0.2 μm, new IDT structures with wider electrode width and new unidirectional transducer fabrication techniques should be developed. In this paper we have described our studies of various IDT structures and shown the theoretical and experimental results of the high frequency unidirectional SAW filters ranging from 5 to 15 GHz. Direct writing electron beam lithography techniques are applied on 128° LiNbO3 and an electrode width of below 0.1 μm has been obtained. Experimental results show an insertion loss of below 10 dB in the 10 GHz range and a high value of directivity has been obtained with the decrease in TTE
Keywords :
electron beam lithography; interdigital transducers; lithium compounds; microwave filters; nanotechnology; surface acoustic wave filters; surface acoustic wave transducers; 0.1 mum; 0.2 mum; 10 dB; 5 to 15 GHz; IDT structures; LiNbO3; SAW devices; direct writing electron beam lithography techniques; directivity; electrode thickness difference type; electrode width; high frequency unidirectional SAW filters; insertion loss; mobile communication systems; nanometer fabrication technology; reflector bank type; surface acoustic wave filters; unidirectional interdigital transducers; unidirectional transducer fabrication techniques; Acoustic waves; Electrodes; Fabrication; Frequency; Mobile communication; SAW filters; Surface acoustic wave devices; Surface acoustic waves; Transducers; Writing;
Conference_Titel :
Ultrasonics Symposium, 1997. Proceedings., 1997 IEEE
Conference_Location :
Toronto, Ont.
Print_ISBN :
0-7803-4153-8
DOI :
10.1109/ULTSYM.1997.662980