Title :
Multiphysics Simulation of Electromagnetic Shielding and Thermal Stressing within Ceramic and Silicon Multilayer Packages for RF Applications
Author :
Ding, Jian ; Linton, David ; Armstrong, Mervyn ; Mitchell, Neil ; Fusco, Vince
Author_Institution :
The Inst. of Electron., Commun. & Inf. Technol., Queen´´s Univ. Belfast
Abstract :
A multiphysics finite element method (FEM) based software, COMSOLtrade has been used to simulate coupled electromagnetic shielding and thermal stress issues for system-in-package (SiP) modules. The ceramic and silicon carriers under study have embedded shielding ground planes. Power HEMT RF devices in GaAs technologies are embedded on and within the carrier causing local thermal hotspots. Thermal cooling is performed using thermal vias. The electromagnetic interaction of thermal vias with the embedded ground plane is studied for hole clearance and via size
Keywords :
III-V semiconductors; ceramic packaging; cooling; electromagnetic shielding; finite element analysis; gallium arsenide; power HEMT; silicon; system-in-package; thermal stresses; COMSOLtrade; GaAs; Si; ceramic carriers; ceramic multilayer packages; electromagnetic interaction; electromagnetic shielding; embedded shielding ground planes; finite element method; multiphysics simulation; power HEMT; radiofrequency applications; radiofrequency devices; silicon carriers; silicon multilayer packages; system-in-package modules; thermal cooling; thermal stressing; Application software; Ceramics; Electromagnetic coupling; Electromagnetic shielding; Finite element methods; Nonhomogeneous media; Packaging; Radio frequency; Silicon; Thermal stresses;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280079
