Title :
Predicting the Shear Strength of a Wire Bond Using Laser Vibration Measurements
Author :
Gaul, Holeger ; Schneider-Ramelow, Martin ; Lang, Klaus-Dieter ; Reichl, Herbert
Author_Institution :
Tech. Univ. of Berlin
Abstract :
Wedge/wedge bonding with AlSi-1 wire on semiconductor chips with aluminum metallization has been investigated. The scope of the article is the modeling of the wedge bond. The description of the bonding process by a physical model shall predict the change of bond quality, depending on a change in bonding parameters. The physical model is based on measurements of the vibration amplitude, induced into the assembly by the ultrasonic (US) power. The model is derived by measurements of the shear strength for various bond times. By fitting the calculation to the measurements, details of the bonding process can be clarified.. By using the model shear force can be calculated by estimation of the deformation of the wire material, the amplitude of the tool, sigma and the transversal force during bonding
Keywords :
aluminium compounds; integrated circuit metallisation; lead bonding; shear strength; AlSi; aluminum metallization; bonding parameters; laser vibration measurements; semiconductor chips; shear strength; ultrasonic power; vibration amplitude; wedge bond; wedge/wedge bonding; wire bond; Aluminum; Bonding processes; Laser modes; Laser theory; Metallization; Predictive models; Semiconductor lasers; Ultrasonic variables measurement; Vibration measurement; Wire;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280091
