Predicting the Shear Strength of a Wire Bond Using Laser Vibration Measurements

Author

Gaul, Holeger ; Schneider-Ramelow, Martin ; Lang, Klaus-Dieter ; Reichl, Herbert

Author_Institution

Tech. Univ. of Berlin

Volume

2

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

719

Lastpage

725

Abstract

Wedge/wedge bonding with AlSi-1 wire on semiconductor chips with aluminum metallization has been investigated. The scope of the article is the modeling of the wedge bond. The description of the bonding process by a physical model shall predict the change of bond quality, depending on a change in bonding parameters. The physical model is based on measurements of the vibration amplitude, induced into the assembly by the ultrasonic (US) power. The model is derived by measurements of the shear strength for various bond times. By fitting the calculation to the measurements, details of the bonding process can be clarified.. By using the model shear force can be calculated by estimation of the deformation of the wire material, the amplitude of the tool, sigma and the transversal force during bonding

Keywords

aluminium compounds; integrated circuit metallisation; lead bonding; shear strength; AlSi; aluminum metallization; bonding parameters; laser vibration measurements; semiconductor chips; shear strength; ultrasonic power; vibration amplitude; wedge bond; wedge/wedge bonding; wire bond; Aluminum; Bonding processes; Laser modes; Laser theory; Metallization; Predictive models; Semiconductor lasers; Ultrasonic variables measurement; Vibration measurement; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.280091

Filename

4060816