DocumentCode :
3221917
Title :
A new approach for reducing line-edge roughness by using a cross-linked positive-tone resist
Author :
Yamaguchi, T. ; Namatsu, H. ; Nagase, M. ; Yamazaki, K. ; Kurihara, K.
Author_Institution :
NTT Basic Res. Labs., Kanagawa, Japan
fYear :
1999
fDate :
6-8 July 1999
Firstpage :
158
Lastpage :
159
Abstract :
Line-edge roughness (LER) of resist patterns has become a serious problem in sub-100nm lithography, because LER leads to variations in device characteristics. In addition to evaluating the degree of LER, many researchers have also tried to reduce LER, In this study, we have proposed cross-linking in positive-tone resist as a new approach for reducing LER.
Keywords :
nanotechnology; photolithography; photoresists; 100 nm; cross-linked positive-tone resist; reducing line-edge roughness; sub-100nm lithography; Aggregates; Chemicals; Computed tomography; Erbium; Fractionation; Laboratories; Lithography; Polymer films; Resists; Technical Activities Guide -TAG;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 1999. Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International
Conference_Location :
Yokohama, Japan
Print_ISBN :
4-930813-97-2
Type :
conf
DOI :
10.1109/IMNC.1999.797525
Filename :
797525
Link To Document :
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