Title :
Improvement of the Adhesive Bond Strength between Metals and Polymers by Plasmachemical and Wet-chemical Pretreatments
Author :
Friedrich, Jorg ; Mix, Renate
Author_Institution :
Fed. Inst. of Mater. Res. & Testing, Berlin
Abstract :
Several adhesion problems between metal layers and polymers exist in various electronic assemblies due to the deficiency or absence of strong covalent bonds associated with the strongly different thermal expansion coefficients of the materials. Here, ways are described to establish well-defined covalent bonds at the interfaces. Additionally, unwished redox-reactions between metals, metal oxides and polymers can disturb covalent bonds and therefore the adhesive bond strength
Keywords :
adhesive bonding; assembling; bonds (chemical); metals; oxidation; polymers; reduction (chemical); thermal expansion; adhesive bond strength; covalent bonds; electronic assemblies; metal layers; plasmachemical pretreatments; polymers; redox-reactions; thermal expansion coefficients; wet-chemical pretreatments; Adhesives; Bonding; Electronic packaging thermal management; Inorganic materials; Plasma applications; Plasma chemistry; Plasma materials processing; Polymers; Semiconductor materials; Thermal expansion;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280106
