DocumentCode
3222140
Title
Accident Analysis to Avoid PPM Peaks on Purchased Semiconductors Components
Author
Kleyna, Reinhard ; Cerva, Hans ; Franke, Martin ; Kiening, Matthias ; Muench, Rolf
Author_Institution
Siemens VDO Automotive, Siemens Corporate Technol., Babenhausen
Volume
2
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
848
Lastpage
853
Abstract
Accidents are sudden but random, economically severe quality problems during product development or delivery with failure rates higher than 100ppm. Several recent cases were studied to derive common features which allow a classification of the events. Focused on semiconductor front end technology the interface between design and process technology and the currently strong process-oriented quality approach were found to be sources for accidents. As an alternative a product function oriented view is proposed which entails e.g. new statistical process control methods. The measures will have to be identified and set up together with the semiconductor industry
Keywords
accident prevention; electronics industry; semiconductor device manufacture; PPM peaks; accident analysis; process oriented quality approach; purchased semiconductors components; quality problems; semiconductor front end technology; semiconductor industry; Accidents; Automotive engineering; Cause effect analysis; Electronic components; Electronic equipment testing; Failure analysis; History; Process design; Product development; Protection;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280110
Filename
4060835
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