DocumentCode
3222195
Title
Machine and Process Capability Analysis in SMT Manufacturing
Author
Schmitt, Romain
Author_Institution
CeTaQ GmbH, Radeberg
Volume
2
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
867
Lastpage
872
Abstract
The strive towards increasing capacity, throughput on lead-free processes and accuracy with more and ever smaller components has changed the way of producing SMT boards. The need for statistical process control for each part of the process has become paramount in today´s electronics manufacturing to keep up with market demand, ensure customer satisfaction and reduce defect rates
Keywords
consumer electronics; printed circuit manufacture; surface mount technology; SMT manufacturing; customer satisfaction; defect rates reduction; lead free processes; process capability analysis; statistical process control; Consumer electronics; Control systems; Electrical equipment industry; Electronic equipment manufacture; Industrial control; Manufacturing industries; Manufacturing processes; Process control; Production; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280113
Filename
4060838
Link To Document