Title :
Evaluation of Metallic Nano-Lawn Structures for Application in Microelectronic Packaging
Author :
Fiedler, Stefan ; Zwanzig, Michael ; Schmidt, Ralf ; Auerswald, Ellen ; Klein, Matthias ; Scheel, Wolfgang ; Reichl, Herbert
Author_Institution :
Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin
Abstract :
New applications of template-generated structures and surfaces are foreseen in microelectronic joining, photonics, and analytical chemistry. They require a special tuning of morphological and topological parameters. High-resolution imaging techniques allow for optimising surface properties and grain size of metal-rod decorated surfaces. Submicron wires and more complex "lawn"-structures with diameters of 600-50 nm have been produced by galvanic deposition at porous polymer templates. Their application for low-temperature interconnect formation is under evaluation. First results indicate that single-metal and layered "nano-lawn" can be attractive for microsystem technology in general, but also in analytical chemistry and related fields. Template techniques are discussed and experimental approaches to use gold nano-lawn are presented. The development of new materials and appropriate techniques will be useful for future packaging technologies of (micro-) electronics to come
Keywords :
gold; integrated circuit interconnections; integrated circuit packaging; joining materials; nanotechnology; nanowires; 50 to 600 nm; analytical chemistry; galvanic deposition; grain size; high-resolution imaging techniques; low-temperature interconnect formation; metal-rod decorated surfaces; metallic nano-lawn structures; microelectronic joining; microelectronic packaging; morphological parameters; photonics; porous polymer templates; submicron wires; surface properties; template techniques; topological parameters; Chemical technology; Chemistry; Grain size; High-resolution imaging; Microelectronics; Nanostructures; Packaging; Photonics; Surface morphology; Wires;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280116