New Technology for Joining of LTCC and Polymer Assemblies

Author

Franke, Volker ; Sonntag, Frank ; Richter, Georg ; Udo Klotzbact

Author_Institution

Fraunhofer Inst. Material & Beam Technol., Dresden

Volume

2

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

896

Lastpage

902

Abstract

The main focus of this article lies on the development of a novel joining technology for LTCC ceramic and polymer sub-assemblies utilising laser radiation. Technical processes and the latest results are presented as well as potential future applications. The developed joining process can be divided into two steps utilizing the same laser system: a surface modification of the joining partners and a thermal process that is melting a small portion of the polymer matrix that is being pressed into the roughness of the ceramic surface

Keywords

assembling; ceramic packaging; joining processes; laser beam applications; plastic packaging; surface roughness; LTCC ceramic; ceramic surface roughness; joining process; joining technology; laser radiation; laser system; polymer assemblies; polymer matrix; polymer sub-assemblies; surface modification; thermal process; Assembly; Bioceramics; Biological materials; Ceramics; Conducting materials; Joining materials; Optical materials; Polymers; Sensor systems; Surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.280118

Filename

4060843