High frequency longitudinal-transverse complex vibration systems for ultrasonic wire bonding

Author

Tsujino, Jirornaru ; Yoshihara, Hiroyuki ; Kamimoto, Kazuyoshi ; Osada, Yoshiaki

Author_Institution

Fac. of Eng., Kanagawa Univ., Yokohama, Japan

Volume

1

fYear

1997

fDate

5-8 Oct 1997

Firstpage

849

Abstract

High frequency longitudinal to transverse complex vibration systems of 160 kHz to 1 MHz for ultrasonic wire ball bonding for IC or LSI are studied. Vibration systems of these high frequency and complex vibration welding equipments consist of transverse free-free complex vibration rod 7.0 mm in diameter, two longitudinal vibration systems for driving the transverse vibration rod and a ceramic capillary 1.5875 mm in diameter. Vibration distribution of capillary at high frequency up to 1 MHz is measured at the first time and the conventional capillary is revealed applicable at such high frequencies

Keywords

large scale integration; lead bonding; ultrasonic welding; vibrations; 160 kHz to 1 MHz; IC; LSI; ceramic capillary; high frequency longitudinal-transverse complex vibration system; rod; ultrasonic wire ball bonding; vibration welding; Bonding; Ceramics; Frequency; Large scale integration; Laser modes; UHF integrated circuits; Vibration measurement; Vibrometers; Welding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1997. Proceedings., 1997 IEEE

Conference_Location

Toronto, Ont.

ISSN

1051-0117

Print_ISBN

0-7803-4153-8

Type

conf

DOI

10.1109/ULTSYM.1997.663146

Filename

663146