Title :
Constitutive Modeling of Kinematic-Hardening and Damage in Solder Joints
Author :
Ridout, S. ; Bailey, C. ; Dusek, M. ; Hunt, C.
Author_Institution :
Greenwich Univ., London
Abstract :
Solder constitutive models are important as they are widely used in FEA simulations to predict the lifetime of soldered assemblies. This paper briefly reviews some common constitutive laws to capture creep in solder and presents work on laws capturing both kinematic hardening and damage. Inverse analysis is used to determine constants for the kinematic hardening law which match experimental creep curves. The mesh dependence of the damage law is overcome by using volume averaging and is applied to predict the crack path in a thermal cycled resistor component
Keywords :
cracks; creep testing; finite element analysis; hardening; solders; creep curves; finite element analysis; inverse analysis; kinematic hardening law; solder cracking; solder joints; thermal cycling; volume averaging; Capacitive sensors; Creep; Failure analysis; Fatigue; Kinematics; Plastics; Predictive models; Soldering; Strain measurement; Stress;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280122
