• DocumentCode
    3222478
  • Title

    Analysis of Thermal Shock on the Failure of Thin-Walled Vessel under Thermo-solid Coupled Load

  • Author

    Fan Qin-man ; Wu Yong-hai ; Xu Cheng

  • Author_Institution
    Sch. of Mech. Eng., Nanjing Univ. of Sci. & Technol., Nanjing
  • Volume
    1
  • fYear
    2008
  • fDate
    20-22 Oct. 2008
  • Firstpage
    987
  • Lastpage
    990
  • Abstract
    It is significant to study the structure safety of thin-walled vessel under thermo-solid coupled load. In allusion to a thin-walled vessel of failure receiving low-frequency and high-temperature thermal shock and pressure load, direct coupling model, temperature-related material model and Finite Element Method (FEM) were applied to calculate the response of transient temperature field and transient stress field, based on which the influence of temperature load on failure of the vessel was analyzed. It shows that the node temperature response of the vessel cross-section has obvious thermal-shock characteristics that high temperature of inner wall and large gradient of transient temperature appear; transient peak thermal stress caused by thermal shock is obviously higher than that caused by internal pressure, and the periodic coupled stress plays an important role in the formation of cracks distributing around the placket of the vessel.
  • Keywords
    cracks; failure (mechanical); finite element analysis; marine vehicles; safety; structural engineering; thermal shock; thermal stresses; FEM; cracks; direct coupling model; finite element method; structure safety; temperature- related material model; thermal shock; thermo-solid coupled load; thin-walled vessel; transient peak thermal stress; transient stress field; transient temperature field; Electric shock; Failure analysis; Internal stresses; Load modeling; Safety; Temperature; Thermal loading; Thermal stresses; Thin wall structures; Transient analysis; Thermal Shock; Thermo-Solid Couple; Thin-Walled Vessel;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Computation Technology and Automation (ICICTA), 2008 International Conference on
  • Conference_Location
    Hunan
  • Print_ISBN
    978-0-7695-3357-5
  • Type

    conf

  • DOI
    10.1109/ICICTA.2008.32
  • Filename
    4659636