Title :
Hand pose identification from monocular image for sign language recognition
Author :
Bhuyan, M.K. ; Kar, Mithun Kumar ; Neog, Debanga Raj
Author_Institution :
Dept. of Electron. & Electr. Eng., Indian Inst. of Technol. Guwahati, Guwahati, India
Abstract :
In this paper, a novel approach for hand pose recognition is proposed by analyzing the textures and key geometrical features of the hand. A skeletal hand model is constructed to analyze the abduction/adduction movements of the fingers and subsequently, texture analysis is performed to consider some inflexive finger movements. Probabilistic distributions of the geometric features are considered for modelling intra-class abduction/adduction variations. Gestures differing in inflexive positions of fingers are classified based on Homogeneous Texture Descriptors (HTD), where the texture region is characterized using the mean energy and energy deviation from a set of frequency channels. Similarity measures are computed between input gestures and pre-modelled gesture patterns from a database by considering intra class abduction/adduction angle variations and inter class inflexive variations. Experimental results show the efficacy of our proposed hand pose recognition system.
Keywords :
gesture recognition; image texture; pose estimation; statistical distributions; visual databases; abduction-adduction movement; frequency channel; hand geometrical feature; hand pose identification; hand pose recognition system; homogeneous texture descriptor; inflexive finger movement; inflexive position; interclass inflexive variation; intraclass abduction-adduction variation; mean energy deviation; monocular image texture analysis; premodelled gesture pattern; probabilistic distribution; sign language recognition; skeletal hand model; Computational modeling; Feature extraction; Joints; Mathematical model; Solid modeling; Three dimensional displays; Thumb; Geometrical features; Homogeneous texture descriptors; Proximity measure;
Conference_Titel :
Signal and Image Processing Applications (ICSIPA), 2011 IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4577-0243-3
DOI :
10.1109/ICSIPA.2011.6144163