Title :
Creep-Fatigue Life of Sn-8Zn-3Bi Solder Under Multiaxial Loading
Author :
Itoh, Takayuki ; Yamamoto, Takaei ; Sakane, Masao ; Tsukada, Yutaka
Author_Institution :
Dept. of Mech. Eng., Fukui Univ.
Abstract :
This paper describes the creep-fatigue life of Sn-8Zn-3Bi solder under multiaxial loading. Push-pull and reversed torsion loading tests were carried out using 5 types of strain waveforms, i.e., fast-fast, fast-slow, slow-fast, slow-slow and hold-time waveforms. The effects of strain waveform and strain multiaxiality on the creep-fatigue life were discussed. Strain waveform had a significant effect on creep-fatigue life under multiaxial loading. In the push-pull test, the smallest creep-fatigue life was observed in slow-fast strain waveform. A similar waveform effect was found in the reversed torsion test, but creep-fatigue lives in the reversed torsion tests were longer twice than those in the push-pull tests at the same strain waveform. Conventional creep-fatigue damage models were applied to the experimental data for predicting creep-fatigue lives under multiaxial loading. Only the grain boundary sliding model predicted the multiaxial creep-fatigue life within a small scatter
Keywords :
bismuth alloys; creep testing; fatigue testing; solders; tin alloys; torsion; zinc alloys; SnZnBi; creep-fatigue damage models; creep-fatigue life; grain boundary sliding model; multiaxial loading; push-pull tests; reversed torsion loading tests; solder; strain multiaxiality; strain waveform; Capacitive sensors; Electronic equipment testing; Environmentally friendly manufacturing techniques; Fatigue; Lead; Mechanical engineering; Microstructure; Solids; System testing; Thermal stresses;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280135
