• DocumentCode
    3222762
  • Title

    Implementation of Methods to Characterise Encapsulation Behaviour of Intended Implantable Materials

  • Author

    Sascha, Kammer ; Marzellus, Grobe Holthaus ; Jui-Mei, Hsu ; Peter, Koch Klaus ; Florian, Solzbacher

  • Author_Institution
    Neuroprosthetics Group, Fraunhofer Inst. for Biomed. Eng., St. Ingbert
  • Volume
    2
  • fYear
    2006
  • fDate
    5-7 Sept. 2006
  • Firstpage
    1040
  • Lastpage
    1046
  • Abstract
    Investigation methods on polymer encapsulation materials were implemented to determine the quality of the biocompatible coating and the adhesion performance of several coating layers. Besides a general view of possible testing applications, investigations of material combinations of silicon carbide, parylene C, medical grade silicones and epoxies were carried out to qualify and quantify the layer performance. These tests were focused on tensile strength methods and shear tests. Further characterisations on the encapsulation quality of the used materials were done by using leakage current measurements. Investigations on leakage current test samples with different material combinations showed promising encapsulation behaviour of medical grade silicones and epoxies as well as silicon carbide/parylene C combination. Apart from the investigations which have been carried out, this paper shows possibilities and suggestions for future measurement methods in the field of encapsulation behaviour
  • Keywords
    adhesion; coatings; encapsulation; leakage currents; polymers; prosthetics; silicones; tensile strength; SiC; adhesion performance; biocompatible coating; coating layers; encapsulation behaviour; encapsulation quality; intended implantable materials; leakage current measurements; medical grade epoxies; medical grade silicones; parylene C; polymer encapsulation materials; shear tests; tensile strength methods; Adhesives; Biological materials; Biomedical materials; Coatings; Encapsulation; Leakage current; Materials testing; Medical tests; Polymer films; Silicon carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Systemintegration Technology Conference, 2006. 1st
  • Conference_Location
    Dresden
  • Print_ISBN
    1-4244-0552-1
  • Electronic_ISBN
    1-4244-0553-x
  • Type

    conf

  • DOI
    10.1109/ESTC.2006.280139
  • Filename
    4060864