DocumentCode :
3222931
Title :
Optimisation Modelling for Design of Advanced Interconnects
Author :
Stoyanov, S. ; Bailey, C.
Author_Institution :
Centre for Numerical Modelling & Process Anal., Greenwich Univ., London
Volume :
2
fYear :
2006
fDate :
5-7 Sept. 2006
Firstpage :
1108
Lastpage :
1117
Abstract :
This paper describes a computational strategy for virtual design and prototyping of electronic components and assemblies. The design process is formulated as a design optimisation problem. The solution of this problem identifies not only the design which meets certain user specified requirements but also the design with the maximum possible improvement in particular aspects such as reliability, cost, etc. The modelling approach exploits numerical techniques for computational analysis (finite element analysis) integrated with numerical methods for approximation, statistical analysis and optimisation. A software framework of modules that incorporates the required numerical techniques is developed and used to carry out the design optimisation modelling of fine-pitch flip-chip lead free solder interconnects
Keywords :
circuit optimisation; fine-pitch technology; finite element analysis; flip-chip devices; design optimisation problem; electronic assemblies; fine-pitch flip-chip solder interconnects; finite element analysis; statistical analysis; virtual design; Assembly; Costs; Design optimization; Electronic components; Finite element methods; Numerical models; Optimization methods; Process design; Statistical analysis; Virtual prototyping;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280148
Filename :
4060873
Link To Document :
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