DocumentCode
3223058
Title
Assessing the Assumptions Used in Reliability Prediction Modeling
Author
Goel, Anuj ; Graves, Robert J.
Author_Institution
Rensselaer Polytech. Inst., Troy, NY
Volume
2
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
1143
Lastpage
1148
Abstract
This paper is aimed at improving the reliability of printed circuit board (PCB) in the electronic packaging/manufacturing industry. It summarizes the research done in the area of electronic system reliability, assesses the approaches and assumptions used in the calculation of electronic system failure rates, and proposes a method to calculate the failure rate of the system that does not rely on the assumption of independent failures. The paper starts with an introduction to reliability theory, justifies the role of reliability prediction methods, provides a historical overview, reviews the key models which are currently in use, and presents the proposed algorithm and results. A weighted-rank method is used to find the failure rate dependency (or correlation) between various components
Keywords
electronics packaging; manufacturing industries; printed circuits; reliability; electronic packaging; electronic system failure; electronic system reliability; manufacturing industry; printed circuit board; reliability prediction methods; reliability prediction modeling; reliability theory; Consumer electronics; Electronic equipment; Integrated circuit modeling; Integrated circuit reliability; Integrated circuit technology; Military computing; Predictive models; Printed circuits; Reliability theory; Very high speed integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280154
Filename
4060879
Link To Document