DocumentCode
3223196
Title
Comparison of the Phase Morphology for Several Sn-Ag Based Solder Ball Alloys in FBGA Packages
Author
Leinert, S. ; Martin, N. ; Breuer, D. ; Werner, W.
Author_Institution
Qimonda Dresden GmbH & Co.
Volume
2
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
1182
Lastpage
1186
Abstract
In this paper the method of chemical solder removal is treated as a convenient possibility to gather information about the intermetallic compounds that form at the landing pad interfaces of solder joints. Details especially concerning the morphology of the grains can easily be overlooked or are not so easily accessible with the common approach of a cross section. Several cases are discussed where different factors influence the phase appearance
Keywords
alloys; ball grid arrays; reflow soldering; silver; solders; tin; Ag; FBGA packages; Sn; chemical solder removal; intermetallic compounds; phase morphology; solder ball alloys; Environmentally friendly manufacturing techniques; Etching; Intermetallic; Lead; Materials testing; Morphology; Packaging; Soldering; Temperature; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280159
Filename
4060884
Link To Document