Title :
Analysis of the thermo mechanical effects on Packaging Process of Performance enhanced AMLCD´s and the optical performance of the display
Author :
Lee, Yek Bing ; Bailey, Chris ; Lu, Hua ; Riches, Steve ; Bartholomew, Martin ; Tebbit, Nigel
Author_Institution :
Greenwich Univ.
Abstract :
The performance enhancement of AMLCD´s has been hindered with problems encountered during the curing process, such as window framing and de-lamination of the glass and adhesive. A thermo-mechanical analysis using FEA was conducted to help optimise the design of the rugged display and enhance the optical performance
Keywords :
finite element analysis; liquid crystal displays; packaging; thermomechanical treatment; AMLCD; FEA; finite element analysis; packaging process; thermo mechanical effects; Active matrix liquid crystal displays; Aerospace industry; Capacitive sensors; Cathode ray tubes; Glass; Liquid crystal displays; Material properties; Packaging; Performance analysis; Thermal stresses;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280164
