DocumentCode :
3223388
Title :
Dynamic Re-Configuration Model for System-On-Chip Design for Test and Testability
Author :
Chindris, Gabriel ; Pitica, Dan ; Muresan, Marius
Author_Institution :
Dept. of Appl. Electron., Tech. Univ. of Cluj-Napoca
Volume :
2
fYear :
2006
fDate :
5-7 Sept. 2006
Firstpage :
1236
Lastpage :
1241
Abstract :
The more and more increased complexity of the modern VLSI chips, along with the integration of analogue and digital parts in the same chip, implies a proportionally equivalent rise of the costs involved in design for testability. The paper presents a new method for designing test procedures inside system-on-chip cores aiming to reduce the related costs and to increase the quality of production. The new proposed structure for testing is based on the re-configurability feature of the SoC devices and will rely in the next scenario: the core provider will design a testing configuration stored somewhere on chip (it will steal only 10% of the on-chip flash memory), the user configuration (the active one) will be loaded over the testing configuration (which is enabled) allowing user to include it\´s own testing procedures inside it. As a result, the testing configuration will waste no resources from the designer\´s point of view. When tested, the SoC will "morph " in the TESTING mode and will allow full testing procedures accordingly to standards. When returning to the \´normal\´ mode, the SoC will regain its full functionality, hiding the test configuration and freeing-up the resources for designer\´s use
Keywords :
design for testability; system-on-chip; SoC devices; dynamic re-configuration model; system-on-chip design for test; testing configuration; Circuit testing; Costs; Design for testability; Electronic equipment testing; Fabrication; Modems; Pins; System testing; System-on-a-chip; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280168
Filename :
4060893
Link To Document :
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