DocumentCode :
3223442
Title :
Fully Automated Multi Sensor Metrology for Use in Microelectronics
Author :
Fries, Thomas
Author_Institution :
Fries Res. & Technol. GmbH, Gladbach
Volume :
2
fYear :
2006
fDate :
5-7 Sept. 2006
Firstpage :
1255
Lastpage :
1260
Abstract :
The surface metrology tool MicroPro was developed by FRT GmbH in Germany to fulfil the needs of semiconductor and microelectronics industry from lab to production. The system investigates wafers, PCB and device surfaces and estimates TTV, bow or warp all automatically. Also high resolution topography, roughness or profiles for the whole surface can be performed. An outstanding innovation is the modular multi sensor technology. The various optical sensors are fast and accurate. Maximum height resolution is 3 nm. Furthermore the system can optionally be equipped with AFM. The system does automated evaluation of the following metrological data: total thickness variation TTV, bow, warp, roughness, film thickness, step height, pitch, profile, contour, edge structures, trenches, topography, geometry, coplanarity, critical dimensions und angles
Keywords :
characteristics measurement; optical sensors; semiconductor technology; sensor fusion; high resolution topography; microelectronics; multisensor metrology; optical sensors; Geometrical optics; Metrology; Microelectronics; Optical films; Optical sensors; Production; Rough surfaces; Surface roughness; Surface topography; Technological innovation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280172
Filename :
4060897
Link To Document :
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