Title :
Defects detecting method of copper interconnects based on signal reflection theory
Author :
Zhou, Wen ; Liu, Hongxia ; Wei, Jianjun ; Kuang, Qianwei
Author_Institution :
Sch. of Microelectron., Xidian Univ., Xi´´an, China
Abstract :
Based on the signal reflection theory, this paper investigates the diction method of loss object defects in copper interconnects. The signal is reflected at the edge of impedance discontinuity, which is caused by the defects in interconnects. The reflection results of defects with different size and with different signal rise time are investigated. The results show that signal reflection caused by the defects is very obvious for the defect of 1 ¿m length and signal rise time of 0.01 ps. The defects can be detected easily in this case. The reasons of rapid rise time of signal are analyzed at the end of this paper.
Keywords :
copper; integrated circuit interconnections; copper interconnects; defects detecting method; diction method; loss object defects; signal reflection theory; size 1 mum; time 0.01 ps; Copper; Delay effects; Distributed parameter circuits; Impedance; Integrated circuit interconnections; Integrated circuit reliability; Object detection; Reflection; Transmission lines; Voltage; copper interconnections; defect detecting method; loss object defects; signal reflection;
Conference_Titel :
Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-4297-3
Electronic_ISBN :
978-1-4244-4298-0
DOI :
10.1109/EDSSC.2009.5394156
