DocumentCode :
3223467
Title :
Temperature Field Simulation of Thick-Film Microcircuits Using Electro-Thermal Analogy
Author :
Blad, Grzegorz ; Kalita, Wlodzimierz ; Klepacki, Dariusz ; Potencki, Jerzy ; Weglarski, M.
Author_Institution :
Dept. of Electron. & Commun. Syst., Rzeszow Univ. of Technol.
Volume :
2
fYear :
2006
fDate :
5-7 Sept. 2006
Firstpage :
1261
Lastpage :
1265
Abstract :
The paper presents some aspects of describing of thermal model of the thick-film microcircuits with equivalent model (based on RC elements) which is used in temperature field simulation using PSPICE program. The proposed method of temperature simulation using equivalent RC models is based on well-known Beuken theory and is much more easier and "intuitive" for designers of the electronic equipment
Keywords :
equivalent circuits; heat transfer; thick film circuits; Beuken theory; PSPICE program; electro-thermal analogy; equivalent RC models; temperature field simulation; thick-film microcircuits; Capacitance; Circuit simulation; Electric resistance; Equations; Equivalent circuits; Nonhomogeneous media; SPICE; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280173
Filename :
4060898
Link To Document :
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