• DocumentCode
    32235
  • Title

    Adjacent-MBU-Tolerant SEC-DED-TAEC-yAED Codes for Embedded SRAMs

  • Author

    Neale, Adam ; Jonkman, Maarten ; Sachdev, Manoj

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
  • Volume
    62
  • Issue
    4
  • fYear
    2015
  • fDate
    Apr-15
  • Firstpage
    387
  • Lastpage
    391
  • Abstract
    As technology scaling increases embedded static random access memory bit-cell density, the number of soft errors due to radiation-induced multiple-bit upsets (MBUs) also increases. Traditionally, these errors have been addressed using a simple error correction code (ECC) combined with word interleaving. With continued scaling, however, errors beyond this setup begin to emerge. Although more powerful ECCs exist, they come at an increased overhead in terms of area and latency. Additionally, interleaving adds complexity to the system and may not always be feasible for the given architecture. In this brief, a set of double adjacent error correction (DAEC) codes is modified to provide triple adjacent error correction for a cost of zero additional check-bits over the code´s DAEC equivalent, yielding a 2.25× reduction in bit-level soft error rate for a 22-nm MBU error channel model. MATLAB simulation and HDL synthesis results are included for standard 16- and 32-data-bit memory word sizes and compared against existing codes.
  • Keywords
    SRAM chips; circuit simulation; error correction codes; mathematics computing; radiation hardening (electronics); HDL synthesis; MATLAB simulation; adjacent error correction; double adjacent error correction codes; embedded SRAMs; radiation-induced multiple-bit upsets; soft errors; word interleaving; Decoding; Delays; Encoding; Error correction; Error correction codes; Very large scale integration; Error correction codes (ECCs); memories; multiple bit upsets (MBU); multiple-bit upsets (MBU); soft errors;
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems II: Express Briefs, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1549-7747
  • Type

    jour

  • DOI
    10.1109/TCSII.2014.2368262
  • Filename
    6949629