Title :
Recent development of temperature compensated SAW Devices
Author :
Hashimoto, Ken-Ya ; Kadota, Michio ; Nakao, Takeshi ; Ueda, Masanori ; Miura, Michio ; Nakamura, Hiroyuki ; Nakanishi, Hidekazu ; Suzuki, Kenji
Author_Institution :
Grad. Sch. of Eng., Chiba Univ., Chiba, Japan
Abstract :
This paper reviews recent progress of temperature compensated surface acoustic wave (SAW) devices for wireless communications. First, temperature compensation techniques based on the SiO2 deposition and the wafer bonding are explained, and their implementation into real devices are discussed. Finally, we will show how high performances have been realized by the use of these technologies.
Keywords :
surface acoustic wave devices; wafer bonding; temperature compensated SAW device; temperature compensated surface acoustic wave device; temperature compensation; wafer bonding; wireless communication; Electrodes; Insertion loss; Resonant frequency; Substrates; Surface acoustic waves; Surface treatment;
Conference_Titel :
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4577-1253-1
DOI :
10.1109/ULTSYM.2011.0021
