Title :
Emerging From Lab to LAP: Development of Large Area Processing Technologies for Low-Cost Photonic Interconnects on PCBs
Author :
Immonen, M. ; Tian, D. ; Junnila, S. ; Tarja Rapala-Virtaneir
Author_Institution :
Aspocomp Oy, Espoo
Abstract :
We have studied and developed technologies to embedded high-speed optical interconnects on printed circuit boards (PCB). In this paper, we show results of fabricating optical-PCBs on a production scale panels in a modern high-density interconnect-PCB (HDI-PCB) process environment. Impacts on board design and manufacturing are studied with the developed optical technology verifiers. One verifier is an optical-PCB with 3D optical routings realized with embedded waveguides, integrated i/o couplers and optical vias. Another one is a system level optical board assembly (O-PCB-A) with 10 Gb/s Tx/Rx devices on surface mounted ball grid array (BGA) modules implemented for optical link analysis. Fabricated boards are characterized of their functionality, physical characteristics and optical alignment throughout the critical optical path. Based on the results, capabilities of a modern production infrastructure to fabricate optical-PCBs and board assemblies are discussed. Focus in the analysis is on manufacturability and on factors affecting functionality, performance and yield
Keywords :
assembling; ball grid arrays; integrated optoelectronics; optical interconnections; printed circuit design; printed circuit manufacture; surface mount technology; 10 Gbit/s; 3D optical routings; BGA modules; HDI-PCB process; PCB; critical optical path; embedded waveguides; high-density interconnect-PCB process; high-speed optical interconnects; integrated i/o couplers; large area processing technologies; low-cost photonic interconnects; optical alignment; optical link analysis; optical technology verifiers; optical vias; optical-PCB; printed circuit boards; surface mounted ball grid array modules; system level optical board assembly; High speed optical techniques; Integrated circuit interconnections; Integrated optics; Manufacturing; Optical design; Optical interconnections; Optical waveguides; Photonics; Printed circuits; Production;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
DOI :
10.1109/ESTC.2006.280186
