DocumentCode :
3223753
Title :
Waferless metrology job creation
Author :
Harris, Thomas A. ; Ridens, Martin G. ; Singh, Bhanu P. ; Baaklini, Edouard P.
Author_Institution :
Motorola Inc., Chandler, AZ, USA
fYear :
1995
fDate :
13-15 Nov 1995
Firstpage :
61
Abstract :
Summary form only given, as follows. Discusses waferless job creation, which need not wait for wafer processing and therefore permits elimination of metrology associate delays during new product introduction. At Motorola´s MOS-12 facility, implementation of waferless job creation on CD, overlay, and film thickness measurement tools has reduced new product introduction time by 2 days. In addition, because of standardization of metrology structures, there is much greater consistency in measurements across multiple products. The key components for successfully achieving waferless set up of metrology jobs are standardizing metrology in scribe structures, incorporating specialized inscribe pattern recognition features, tightly matching machines, and directly manipulating job plans. By having standard CAD libraries for each type of measurement the coordinates of all measurement features are known. By using optimized in scribe pattern recognition features, target images can be reused on new products. Tight matching of machines permits job plans written on one machine to be copied to all similar machines without modification. Direct manipulation of job plans eliminates the need for a wafer during job creation.
Keywords :
CAD/CAM; MOS integrated circuits; integrated circuit manufacture; integrated circuit measurement; production testing; thickness measurement; CD measurement; Motorola MOS-12 facility; film thickness measurement; metrology structures; overlay measurement; pattern recognition features; product introduction; scribe structures; standard CAD libraries; waferless job creation; Coordinate measuring machines; Delay; Libraries; Measurement standards; Metrology; Pattern matching; Pattern recognition; Process control; Standardization; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995
ISSN :
1078-8743
Print_ISBN :
0-7803-2713-6
Type :
conf
DOI :
10.1109/ASMC.1995.484340
Filename :
484340
Link To Document :
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