Title :
Ultra-Flat "Mounted" Electronics
Author :
Haberger, Karl ; Feil, Michael
Author_Institution :
Fraunhofer Inst. for Reliability & Micro-Integration, Munich
Abstract :
The paper proposes a method to place encapsulated devices with a size of typically 100 mum micro capsules of this size can be fabricated in batch processes, and they can be dispensed or printed by coarse screen printing techniques. The electric properties of a desired element are roughly defined by the printing pattern, not by the single micro capsule. This means a lot of capsules form a single device. In order to provide an oriented deposition, as necessary in case of polarization dependent deposition, a magnetic alignment is proposed
Keywords :
encapsulation; printed circuits; batch processes; coarse screen printing; electric properties; encapsulated devices; magnetic alignment; oriented deposition; polarization dependent deposition; printing pattern; single microcapsule; ultra-flat mounted electronics; Capacitors; Conductors; Costs; Dielectric substrates; Dielectric thin films; Electronic equipment testing; Polymers; Printing; Resistors; Stability;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280187
