Avoiding the pitfalls in the use of surface analysis in the IC industry

Author

Beck, S.E. ; Gilicinski, A.G.

Author_Institution

Air Products & Chem. Inc., Allentown, PA, USA

fYear

1995

fDate

13-15 Nov 1995

Firstpage

68

Lastpage

75

Abstract

A variety of surface analytical tools are currently available. With each of these tools come hidden pitfalls that one map encounter in the process of doing surface analysis. Examples of the use of X-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometry (SIMS), total reflection X-ray fluorescence (TXRF), and atomic force microscopy (AFM) in the development of a novel vapor phase cleaning methodology are used to illustrate many of these pitfalls. Suggestions are made to assist users of these techniques in avoiding these pitfalls.

Keywords

X-ray fluorescence analysis; atomic force microscopy; integrated circuit manufacture; integrated circuit measurement; mass spectroscopy; photoelectron spectroscopy; secondary ion mass spectroscopy; surface contamination; surface topography measurement; AFM; IC industry; SIMS; TXRF; X-ray photoelectron spectroscopy; XPS; atomic force microscopy; secondary ion mass spectrometry; surface analysis; surface roughness; total reflection X-ray fluorescence; vapor phase cleaning methodology; Atomic force microscopy; Atomic measurements; Chemical analysis; Cleaning; Filters; Fluorescence; Mass spectroscopy; Photoelectron microscopy; Reflection; Surface contamination;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995

ISSN

1078-8743

Print_ISBN

0-7803-2713-6

Type

conf

DOI

10.1109/ASMC.1995.484343

Filename

484343